CS-FLUX Reballing & Reflow Service for 5G Devices

Code: 56827

Category: Soldering and Tools

Product warranty: 12 months

Availability: Limited stock

11.00
CS-FLUX when heated at around 150 degrees (Celsius) turns into liquid and covers the small gap between the BGA component and the PCB complitelly. This way all solder balls are covered with CS-FLUX and durring reflow or removal of the BGA componets all PCB and componet pads and balls are protected.
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